Flex PCB Manufacturer

Flexible Circuits


Most process problems that appear dur-
ing the etching stage of printed circuit produc-
tion can be traced to one of two general areas.
The most obvious causes (though not nec-
essarily the most common) of etching prob-
lems occur in the etching equipment itself, ei-
ther through equipment failure or mis-adjust-
ment or chemistry outside normal operating
parameters. As is often the case in printed cir-
cuit processing, anomalies detected during or
after the etching step may trace back to techni-
cal issues induced during prior processing steps
but not detected until the boards are processed
through the etcher. An example would be resist
scum left on the board during the stripping of
a plating resist, which can cause uneven etch-
ing to occur, although blocked nozzles, “track-
ing” from rollers, uneven distribution (top to
bottom, or across the machine) of spray pres-
sure can all mimic the effects of incomplete re-
sist removal under some circumstances.
Figure 1 shows what appears as unetched
copper. The excess remaining copper will lead
to either a short or at the very least violate the
spacing requirements. The possible causes for
this defect as well as likely solutions are listed
as pcture
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