Chil ultra-thin non-adhesive soft board polyimide non-adhesive polyimide
Santiago de Chil ultra-thin non-adhesive soft board substrate-adhesiveless polyimide-non-adhesive polyimide
Flexible Printed Circuit (FPC), referred to as flexible board, has the advantages of softness, lightness, thinness and flexibility. In recent years, under the trend of light, thin, short and small, information electronic products Has been widely used in notebook computers, digital cameras, mobile phones, liquid crystal displays and other uses.
Traditional soft board substrate is mainly based on PI film / adhesive / copper foil three layer structure, followed by agent is Epoxy / Acrylic mainly, but then the heat resistance and dimensional stability is poor, long-term use Temperature limited to 100 ℃ ~ 120 ℃, making the three-tier flexible plastic substrate (3-Layer FCCL) of the application area is limited. The newly developed 2-Layer FCCL (2-Layer FCCL) is composed of PI film / copper foil only, because it does not require the use of adhesives and has long-term reliability, dimensional stability, heat resistance, chemical resistance, etc. High-performance, thin-line, high-density trend, so the plastic substrate is bound to become the mainstream of the market, and the future of copper thickness of 5μm in the following needs of the high-end electronic products in the direction of light, human, Will be very high.
There are two main manufacturing methods: one is the coating method (Casting), used for single-sided soft board, but there is no way to manufacture ultra-thin copper foil flexible substrate (copper thickness below 12μm) The surface of copper foil flexible substrate process limitations, and can not meet the needs of today's electronic products, short thin. Second, sputtering + plating method (Sputtering + Plating), that is, for profit-making technology production model. The company has been cooperating with ULVAC INC., A Japanese manufacturer of vacuum equipment, to introduce Taiwan's first large-scale continuous thin-film vacuum sputtering equipment. After three years of research and development, Year research and development for the first to splash plating / plating method (Sputtering + Plating) successfully developed ultra-thin non-adhesive soft board substrate manufacturers. Its advantage is the use of dry vacuum sputtering process, with the tape-type (Reel-to-Reel) automated production operations, with the profitability of the first level of electroplating equipment, plating process stability, excellent uniformity of copper plating, To low-cost, high-quality, high-yield advantages, into the application of dynamic and static products of the soft substrate market.
The main product specifications for 3μm, 6μm, 9μm copper foil thickness of single, double-sided soft board substrate, can also be tailored according to customer demand specifications. At present, there is no plastic base material in the United States and Japan, which makes the material cost of domestic soft board manufacturers high. The successful development of technology-made ultra-thin non-adhesive soft substrate, the United States and Japan will be able to break the exclusive market, providing soft-board manufacturers to solve the ultra-fine line production program, and effectively reduce production costs. E.